|Table of Contents|

Research on the Method of Circuit Board PackagingBased on Digital Micro Injection(PDF)

南京师范大学学报（工程技术版）[ISSN:1006-6977/CN:61-1281/TN]

Issue:
2018年02期
Page:
36-
Research Field:
电气与电子工程
Publishing date:

Info

Title:
Research on the Method of Circuit Board PackagingBased on Digital Micro Injection
Author(s):
Liu Xun1; Yang Jianfei1; 2; Qiu Xin1; Yang Jiquan1; Li Sixiang1
(1.Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing,Nanjing Normal University,Nanjing 210042,China)(2.Changzhou Institute of Innovation and Development,Nanjing Normal University,Changzhou 213022,China)
Keywords:
circuit board package; three-dimensional printing; digital micro injection; UV light curing
PACS:
TP23
DOI:
10.3969/j.issn.1672-1292.2018.02.005
Abstract:
The protection and coating technology which is widely used in the field of traditional circuit board packaging has not been able to meet the requirement of batch personalized encapsulation for the demerits of low accuracy,uneven packaging,and low material utilization. In this paper,a digital micro-injection technology is introduced into the field of circuit board packaging,and a circuit board packaging method based on 3D printing digital micro-injection technology is presented. The three-dimensional packaging entity of the protection characteristic can be selectively printed on the surface of PCB with UV resin. This method proposed can meet the packaging requirements for complex components and multi-pin devices. An experimental system for digital micro spray packaging of circuit board is designed in this paper,the feasibility of the proposed method and the stability of the experimental system are verified by the experiment results.

References:

[1] 田芳,乔海灵. 三防保护涂覆工艺及设备[J]. 电子工艺技术,2006,27(2):108-110.
[TIAN F,QIAO H L. Protection technology and equipnent[J]. Electronics process technology,2006,27(2):108-110.(in Chinese)
[[2]鲜飞,刘江涛,易亚军,等. 电子制造业中的三防涂覆技术[J]. 电子工艺技术,2015,36(5):278-280.
[XIAN F,LIU J T,YI Y J,et al. Protection and coating technology of PCBA in electronic assembly field[J]. Electronics process technology,2015,36(5):278-280.(in Chinese)
[[3]鲍秀森,陈红. 选择性涂覆工艺研究[C]//第五届电子产品防护技术研讨会. 承德:中国电子学会,2006.
[BAO X S,CHEN H.The research of selective coating process[C]//The 5th Symposium on Protection of Electronic Products. Chengde:Chinese Institute of Electronic,2006.(in Chinese)
[[4]LI S,CHEN W,LIU F,et al. NN-GA based printing parameters optimization for 3DP[C]//2013 International Symposium on Assembly and Manufacturing. Xi’an:The Institution of Electrical Engineers,2013.
[[5]肖渊,黄亚超. 气动式微滴喷射过程仿真与尺寸均匀性试验研究[J]. 中国机械工程,2014,25(21):2936-2941.
[XIAO Y,HUANG Y C. Simulation of pneumatic driven microdroplet jetting process and experimental study of microdroplet’s uniformity[J]. China mechanical engineering,2014,25(21):2936-2941.(in Chinese)
[[6]尹亚楠. 数字微喷光固化三维打印成型装置设计与试验[D]. 南京:南京师范大学,2015.
[YIN Y N. Design and experiment of digital micro injection curing 3D printing device[D]. Nanjing:Nanjing Normal University,2015.(in Chinese)
[[7]杨沛林,闫文娥,田芳,等. 选择性涂覆设备[J]. 电子工艺技术,2005,26(5):301-303.
[YANG P L,YAN W E,TIAN F,et al. Selective conformal coating equipment[J]. Electronics process technology,2005,26(5):301-303.(in Chinese)
[[8]LE B C,VINCENT S,ARQUIS E. Impact and solidification of indium droplets on a cold substrate[J]. International journal of thermal science,2005,44(3):219-233.
[[9]高宇,杨建飞,邱鑫,等. 基于数字微喷的金属粉末三维打印实现方法研究[J]. 南京师范大学学报(工程技术版),2017,17(3):1-6.
[GAO Y,YANG J F,QIU X,et al. Research on the realization method of 3D printing system of metal powder based on digital micro injection[J]. Journal of Nanjing normal university(engineering and technology edition),2017,17(3):1-6.(in Chinese)
[[10]吴任东,魏大忠,周浩颖,等. 三维数字微滴喷射成形技术的发展现状[J]. 新技术新工艺,2004(2):35-38.vWU R D,WEI D Z,ZHOU H Y,et al. The devlopment of 3D digtal micro-droplet jetting forming[J]. New technology & new process,2004(2):35-38.(in Chinese)
[[11]李宗安. 基于数字化液滴微喷射的微流控芯片制备技术及实验研究[D]. 南京:南京理工大学,2015.
[LI Z A. Digital droplet micro-jetting prepared microfluidic chip technology and its experimental research[D]. Nanjing:Nanjing University of Science and Technology,2015.(in Chinese)
[[12]劳奇成,卢秉恒. 三维打印机喷头的驱动系统[J]. 机械工程师,2003(10):25-27.
[LAO Q C,LU B H.The driving system of solid-ink jet printhead in three-dimension printer[J]. Mechanical engineer,2003(10):25-27.(in Chinese)
[[13]徐林峰. 均匀液滴喷射微制造技术基础研究[D]. 西安:西北工业大学,2005.
[XU L F.Foundational research on uniform droplets spraying micro-fabrication technology[D]. Xi’an:Northwestern Polytechnical University,2005.(in Chinese)

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Last Update: 2018-06-30