参考文献/References:
[1]PUSHPAKARAN B N,BAYNE S B,WANG G Y,et al. Fast and accurate electro-thermal behavioral model of a commercial SiC 1 200 V,80 mΩ power MOSFET[C]//IEEE Pulsed Power Conference. Austin,TX,USA,2015.
[2]DUAN Z,FAN T,WEN X,et al. Improved SiC power MOSFET model considering nonlinear junction capacitances[J]. IEEE Transactions on Power Electronics,2018,33(3):2509-2517.
[3]李川. 电机驱动系统中的碳化硅MOSFET行为模型及电磁兼容研究[D]. 成都:电子科技大学,2018.
[4]许明明,王佳宁,冯之健. 基于SPICE模型的SiC MOSFET静动态特性分析[J]. 电力电子技术,2017,51(9):28-30.
[5]肖婵娟,张豪,梁文才,等. 基于碳化硅MOSFET的器件建模与仿真[J]. 电力电子技术,2018,52(10):122-124.
[6]周志达,葛琼璇,赵鲁,等. 碳化硅器件建模与杂散参数影响机理[J]. 电机与控制学报,2020,24(1):27-37.
[7]郭浩波. 考虑温度特性的SiC MOSFET PSpice建模研究[D]. 北京:北京交通大学,2019.
[8]陈思彤. 基于模型的SiC功率MOSFET温升估计研究[D]. 哈尔滨:哈尔滨工业大学,2020.
[9]王艳. SiC MOSFET模型及短路特性分析[D]. 西安:西安理工大学,2020.
[10]段卓琳,张栋,范涛. SiC电机驱动系统传导电磁干扰建模及预测[J]. 电工技术学报,2020,35(22):4726-4738.
[11]徐文凯,朱俊杰,聂子玲,等. 全碳化硅功率模块开关瞬态特性及损耗研究[J]. 电机与控制应用,2019,46(5):100-106,119.
[12]CHUANG B,RUOBING L,HUI L. Prediction of electromagnetic interference noise in SiC MOSFET module[J]. IEEE Transactions on Circuits and Systems,2019,66(5):853-857.
[13]MANTOOTH H A,PENG K,SANTI E,et al. Modeling of wide bandgap power semiconductor devices—Part I[J]. IEEE Transactions on Electron Devices,2015,62(2):423-433.
[14]SANTI E,PENG K,MANTOOTH H A,et al. Modeling of wide-bandgap power semiconductor devices—Part II[J]. IEEE Transactions on Electron Devices,2015,62(2):434-442.
[15]XU Y,HONG L,ZHENG T Q,et al. Study on the pspice simulation model of SiC MOSFET base on its datasheet[C]//2015 IEEE 2nd International Future Energy Electronics Conference(IFEEC). Taipei,China,2015.
[16]MCNUTT T R,HEFNER A,MANTOOTH H A,et al. Silicon Carbide power MOSFET model and parameter extraction sequence[J]. IEEE Transactions on Power Electronics,2007,22(2):353-363.