[1]刘 训,杨建飞,邱 鑫,等.基于数字微喷的电路板高精度封装方法研究[J].南京师范大学学报(工程技术版),2018,18(02):036.[doi:10.3969/j.issn.1672-1292.2018.02.005]
 Liu Xun,Yang Jianfei,Qiu Xin,et al.Research on the Method of Circuit Board PackagingBased on Digital Micro Injection[J].Journal of Nanjing Normal University(Engineering and Technology),2018,18(02):036.[doi:10.3969/j.issn.1672-1292.2018.02.005]
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基于数字微喷的电路板高精度封装方法研究
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南京师范大学学报(工程技术版)[ISSN:1006-6977/CN:61-1281/TN]

卷:
18卷
期数:
2018年02期
页码:
036
栏目:
电气与电子工程
出版日期:
2018-06-30

文章信息/Info

Title:
Research on the Method of Circuit Board PackagingBased on Digital Micro Injection
文章编号:
1672-1292(2018)02-0036-07
作者:
刘 训1杨建飞12邱 鑫1杨继全1李思祥1
(1.南京师范大学江苏省三维打印装备与制造重点实验室,江苏 南京 210042)(2.南京师范大学常州创新发展研究院,江苏 常州 213022)
Author(s):
Liu Xun1Yang Jianfei12Qiu Xin1Yang Jiquan1Li Sixiang1
(1.Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing,Nanjing Normal University,Nanjing 210042,China)(2.Changzhou Institute of Innovation and Development,Nanjing Normal University,Changzhou 213022,China)
关键词:
电路板封装三维打印数字微喷紫外光固化
Keywords:
circuit board packagethree-dimensional printingdigital micro injectionUV light curing
分类号:
TP23
DOI:
10.3969/j.issn.1672-1292.2018.02.005
文献标志码:
A
摘要:
传统电路板封装领域广泛采用的三防漆喷涂工艺由于存在精度低、封装不均匀、材料利用率低等缺点,越来越无法满足电路板封装对批量个性化封装的需求. 将数字微喷技术引入电路板封装领域,提出一种基于3D打印数字微喷技术的电路板封装方法,该方法以UV树脂作为封装材料,能够选择性地在电路板表面打印出具有保护特性的三维封装实体,满足复杂元器件以及多引脚器件的封装要求. 同时设计了电路板数字微喷封装实验系统,测试结果验证了所提方法的可行性和测试系统的稳定性.
Abstract:
The protection and coating technology which is widely used in the field of traditional circuit board packaging has not been able to meet the requirement of batch personalized encapsulation for the demerits of low accuracy,uneven packaging,and low material utilization. In this paper,a digital micro-injection technology is introduced into the field of circuit board packaging,and a circuit board packaging method based on 3D printing digital micro-injection technology is presented. The three-dimensional packaging entity of the protection characteristic can be selectively printed on the surface of PCB with UV resin. This method proposed can meet the packaging requirements for complex components and multi-pin devices. An experimental system for digital micro spray packaging of circuit board is designed in this paper,the feasibility of the proposed method and the stability of the experimental system are verified by the experiment results.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期:2018-03-14.
基金项目:国家自然科学基金青年基金(51407095)、江苏省自然科学基金(BK20151548)、国家自然科学基金青年基金(51607094)、江苏省“六大人才高峰”项目(GDZB-043)、江苏省产学研前瞻性联合研究项目(BY2016001-01)、南京师范大学“青蓝工程”项目、江苏省研究生科研创新计划(KYCX18_1225).
通讯联系人:杨建飞,副教授,研究方向:三维打印. E-mail:631056602@qq.com
更新日期/Last Update: 2018-06-30