[1]陈 鹏,刘光熙.普通照明用LED模块热测量的分析与探讨[J].南京师范大学学报(工程技术版),2013,13(02):018-21.
　Chen Peng,Liu Guangxi.Analysis and Discussion on the General Lighting with LED Modules for Thermal Measure[J].Journal of Nanjing Normal University(Engineering and Technology),2013,13(02):018-21.
点击复制

普通照明用LED模块热测量的分析与探讨
分享到：

南京师范大学学报（工程技术版）[ISSN:1006-6977/CN:61-1281/TN]

卷:
13卷
期数:
2013年02期
页码:
018-21
栏目:
出版日期:
2013-06-30

文章信息/Info

Title:
Analysis and Discussion on the General Lighting with LED Modules for Thermal Measure
文章编号:
1672-1292(2013)02-0018-04
作者:
陈 鹏; 刘光熙
国家轻工业电光源材料质量监督检测中心,江苏 南京 210015
Author(s):
Chen Peng; Liu Guangxi
The National Light Industry Electronic Light Source Material Quality Surveillance Examining Center,Nanjing 210015,China
关键词:
LED模块; 热测试方法; 标准; 热测量步骤
Keywords:
LED modules; hot test method; standard; hot measurement step
分类号:
TM923.07
文献标志码:
A
摘要:
介绍了LED模块热测试方法的现状,分析了国内相关标准中的热特性测量的要求及测量方法的原理和步骤.通过实验,找出了LED不同的工作特性与其光通输出的关系,结合LED模块热测试中的函数方程关系,对热特性测量步骤中可能出现的问题进行讨论,并提出改进,为准确测量LED模块的性能和保证检测的重现性提供了帮助.
Abstract:
This article introduced the present situation of the LED module hot test method,and analyzed the requirements of thermal characteristics measurement in the relevant standards of China,the principles and the steps of the measuring techniques.By means of the experiments,test,the relationship between the different LED working characteristics and its luminous flux outputs is found out,and combining with the functional equation relations in the LED module hot test,the problems possibly appearing in the steps of thermal characteristics measurementare discussed,and their corresponding improvements are proposed which offers a help for the accurate survey of LED module performance and the guarantee of examination reproducibilty.

参考文献/References:

[1] 潘建根,李倩,伍德辉,等.GB/T24824-2009,普通照明用LED模块的测试方法[S].北京:中国标准出版社,2010.
Pan Jiangen,Li Qian,Wu Dehui,et al.GB/T24824-2009,Measurement methods of LED modules for general lighting[S].Beijing:China Standards Press,2010.(in Chinese)
[2]费翔,钱可元,罗毅.大功率LED结温测量及发光特性研究[J].光电子-激光,2008(3):289-292.
Fei Xiang,Qian Keyuan,Luo Yi.Junction temperature measurement and luminous properties research of high-power LED[J].Journal of Optoelectronics Laser,2008(3):289-292.(in Chinese)
[3]鲍超.SJ/T11394-2009,半导体发光二极管测试方法[S].北京:中国电子技术标准化研究所,2010.
Bao Chao.SJ/T11394-2009,Measure methods of semiconductor light emitting diodes[S].Beijing: China Electronics Technology Standardization Research Institute,2010.(in Chinese)
[4]潘建根,李倩,李明远,等.QB/T4057-2010,普通照明用发光二极管性能要求[S].北京:中国轻工业出版社,2010.
Pan Jiangen,Li Qian,Li Mingyuan,et al.QB/T4057-2010,LEDs for general lighting-performance requirements[S].Beijing: China Light Industry Press,2010.(in Chinese)
[5]Tomas D,Paolo T,Lukas V,et al.Comparison of constanst and temperature dependent blood perfusion in temperature prediction fo superficial hyperthermia[J].Radio Engineering,2010,19(2):281-289.
[6]李鹏.LED灯具的热分析与散热设计[J].中国照明电器,2008(12):17-19.
Li Peng.Thermal analysis and cooling arrangement design for LED luminaire[J].China Light and Lighting,2008(12):17-19.(in Chinese)
[7]鲁祥友,华泽钊,刘美静,等.基于热管散热的大功率LED热特性测量与分析[J].光电子-激光,2009(1):5-8.
Lu Xiangyou,Hua Zezhao,Liu Meijing,et al.Measurement and analysis on thermal characteristics of high power LED based on heat pipe[J].Journal of Optoelectronics Laser,2009(1):5-8.(in Chinese)

备注/Memo

备注/Memo:
收稿日期:2012-12-25.
通讯联系人:陈鹏,工程师,研究方向:光源及发光材料.E-mail:CoLin158@163.com
更新日期/Last Update: 2013-06-30